SINGULATED TECHNOLOGY
• BGA, Micro, CSP, Leadframe
• Wire & Ribbon bonding, Flip Chip
• Stacked Die
• MCM, System in Package, Hybrid
• DUT & Probe
• High Speed Digital, RF & Analog PCB Design
By combining experts in substrate fabrication & assembly with the best CAD tools and top engineering, Singulated Design Services offers the quickest turnaround times for the full-spectrum of die implementations.Singulated is dedicated to meeting our customers quick-turn design needs. Singulated is expertly staffed with design engineers who have a minimum of 6 yrs. of hands-on industry experience.
Our Design Engineers use industry leading design programs and software to complete customer designs.