Singulated Microelectric Design and Turnkey Solutions

We are a printed circuit substrate design and engineering firm delivering quick turn-key package design engineering and simulation services. Our goal is to help increase productivity, efficiency and cost effectiveness of microelectric engineering firms by taking responsibilty of bringing your designs to reality and reduce your overhead to project managment.

By combining experts in substrate fabrication & assembly with the best CAD tools and top engineering, Singulated Technology offers the quickest turnaround times for the full-spectrum of die implementations.

• BGA, CSP, Leadframe

• Wire & Ribbon bonding, Flip Chip

• Stacked Die

• MCM, System in Package, Hybrid

• DUT & Probe

• High Speed Digital, RF & Analog PCB Design

Contact us today to learn more about Singulated Technology.

Oakland Office : 831-295-3530

 

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